发明名称 PRODUCTION OF THIN ALUMINUM NITRIDE FILM
摘要 PURPOSE:To form a uniform thin AlN film excellent in flatness characteristic on a substrate by using a specific organic gas as a gaseous raw material and irradiating a substrate with light of specific wavelength at the time of forming a thin AlN film on a substrate by means of organometallic vapor phase epitaxial growth. CONSTITUTION:A substrate 3 composed of a material having a lattice constant close to that of AlN, such as AlAs, Si, and SiC, is attached to a holder 4 in a vacuum vessel 1, and the inside of the vessel 1 is evacuated by means of a vacuum pump 2. The substrate 3 is heated up to 500-750 deg.C by means of a heater 5, and the substrate 3 is irradiated with light 10a having a wavelength shorter than the wavelength equivalent to the width of forbidden band of the thin AlN film by means of an Xe lamp 9, etc., via a window 14. Simultaneously, as gaseous raw material, alkyl Al gas 6a, such as trimethyl Al, and alkylamine gas 6b, such as dimethylamine, are supplied together with H2 gas 6c into the vacuum vessel 1 through respective nozzles 8a-8c. By this method, the AlN layer in a thin film state having uniform composition and excellent in flatness characteristic of surface can stably be formed on the substrate 3.
申请公布号 JPH0474867(A) 申请公布日期 1992.03.10
申请号 JP19900189062 申请日期 1990.07.16
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 UENO AKIRA;MITSUYU TSUNEO
分类号 C01B21/072;C23C16/34;C23C16/48;C30B25/00;C30B29/38;H01B13/00;H01L21/205;H01L41/39;H03H3/08 主分类号 C01B21/072
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