| 摘要 |
A tape-like carrier for mounting of an integrated circuit including leads secured to a flexible insulating film has metallic radiation films provided on the flexible insulating film around each aperture formed in the film for a semiconductor pellet. The leads project from the respective metallic radiation film inwardly of the respective aperture. Heat of the leads during an inner lead bonding is immediately conducted to the metallic radiation film and released from the surface thereof so that heat of the leads can be more efficiently removed from the leads during the inner lead bonding.
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