| 摘要 |
PURPOSE:To make uniform the filling of a filler by a method wherein compressed air is given to the filler and while the filler is pressed in a through hole and the like through a filling nozzle, it is filled in the through hole or the like via a mask. CONSTITUTION:In case a conductive substance 8 is filled in a through hole 5 in a printed-wiring board, the wiring board is placed and set on the upper side of a cover plate 10 laid on the upper side of a pedestal 9. At this time, a relief hole 11 in the plate 10 is made to coincide with the hole 5 in the wiring board 1 and the wiring board is set. Moreover, a mask 13 provided with a through-hole 12 for filling use is placed and set on the upper side of the wiring-board making the hole 12 coincide with the hole 5 in the wiring board. After that, the substance 8 is discharged through a nozzle end 15 of a nozzle 14, which is cross-linked movably in the horizontal direction on the upper side of the mask 13 and is used for filling the substance 8, and at the same time, the substance 8 is filled in the hole 5 in the wiring board via the hole 12 in the mask 13. Thereby, the conductive substance can be evenly filled without being influenced by the board thickness of the board, the number of the through holes, the diameter of the through holes and the like. |
