| 摘要 |
PURPOSE:To make thin the thickness of the whole package while the contact of wires to a cap is prevented by a method wherein recessed grooves are provided in parts, which oppose to the wires, of the cap for sealing a recessed part, in which a semiconductor chip is housed, of a lead base. CONSTITUTION:A semiconductor chip 1, which can be erased the storage therein by ultraviolet irradiation, for example, is housed in a recessed part in a lead base 2 made 66 ceramic, electrodes of said chip 1 are connected with leads 3 of the base 2 by wires 4 in an arch-form and moreover, the recessed part in the base 2 is sealed by a ceramic cap 6 having an ultraviolet-transmitting glass 5 and a sealing material 7 consisting of an Au-Sn alloy or the like. The cap 6 is provided with grooves 8 of a circular arc-shaped section. These grooves 8 are respectively provided in parts, which oppose to said wires, of the cap so that the cap does not come into contact with the wires 4, by which the chip 1 and the leads 3 are connected to each other in the arch-form. The thickness of a part, in which the glass 5 is buried, of the cap remains unchanged. By such a constitution, the height of a junction part between the base 2 and the cap 6 can be decreased by the amount of the height of the grooves 8 compared to a conventional package. |
