发明名称 METHOD AND APPARATUS FOR FORMING ELECTRODE ON ELECTRONIC COMPONENT
摘要 Disclosed herein is a method of forming strip-shaped electrodes over an end surface of a plate-shaped electronic component and two major surfaces which are in series with the end surface. A slit plate, which is provided with through slits having width corresponding to the width of electrodes to be formed, is located above an electrode paste bath while an electronic component is arranged above the slit plate so that its end surface extends across the through slits. Before or after this step, the electrodes paste is made to swell to a constant level beyond the upper surface of the slit plate, thereby applying the electrode paste to the end surface of the electronic component and the two major surfaces which are in series with the end surface in the form of strips.
申请公布号 US5091212(A) 申请公布日期 1992.02.25
申请号 US19890452755 申请日期 1989.12.19
申请人 MURATA MANUFACTURING CO., LTD. 发明人 SAKAI, NORIO;MINOWA, KENJI;MORIHIRO, SHINJI
分类号 H01C17/28;H01G13/00;H01L21/00;H05K1/09;H05K3/12;H05K3/40 主分类号 H01C17/28
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