发明名称 MULTILAYER PRINTED WIRING BOARD
摘要 PURPOSE:To prevent a decrease in a connecting reliability between a conductive part to a signal line by connecting the conductive parts of adjacent through holes via a bent or curved signal line. CONSTITUTION:A wiring pattern in which the conductive parts 13 of adjacent through holes 11 are connected therebetween via a signal line 12 which is not shortest but bent or curved, is provided. Accordingly, since the length of the wire of the line 12 between the adjacent parts 13 is longer than a distance between the parts 13, various materials for constituting a multilayer printed circuit board are thermally expanded or contracted in a thermal impact test, and even if the distance between the parts 13 is varied, the line 12 is elongated, and hence a connection between the part 13 and the line 12 is not disconnected or the line 12 is not cut. Thus, a connecting strength of the hole to the line against the impact is increased, and a decrease in connecting reliability of the case in which a thermal impact cycle is increased in the test can be prevented.
申请公布号 JPH0456394(A) 申请公布日期 1992.02.24
申请号 JP19900167274 申请日期 1990.06.26
申请人 HITACHI CHEM CO LTD 发明人 KURIHARA SEIICHI
分类号 H05K3/46 主分类号 H05K3/46
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