| 摘要 |
Testing techniques for three-dimensional testing of printed circuit boards overcome the disadvantages that presently exist such as, for example, too little height resolution, low processing speed and difficult manipulation. The testing in the microscopic domain occurs within unaltering, displaceable evaluation windows on the basis of the calculation of cross-sectional areas at each scan point on a printed circuit board. Microscopic testing occurs on the basis of the calculation of defined, simple geometric values within a scan field and by following comparisons to reference values. The arrangement for the implementation of the methods utilize a laser scanner for triangulation, an evaluation unit, and at least one high-resolution, position-sensitive detector.
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