| 摘要 |
<p>PURPOSE:To process a bump electrode to a prescribed height without damaging a substrate such as a semiconductor wafer or the like by a method wherein the top part of the bump electrode is dissolved to be a prescribed shape. CONSTITUTION:The upper-end face of a roller 2 and a semiconductor wafer 1 are set in such a way that a treating liquid on the surface of the roller 2 comes into contact with only top parts of bump electrodes 6 to 10. Since the treating liquid 4 is supplied to the surface of the roller 2 only as a thin film, it does not reach parts other than the top parts of the bump electrodes and it is possible to prevent the bump electrodes from being dissolved excessively. The face on which the bump electrodes of the semiconductor wafer 1 have been formed is set in parallel with a shaft 3; it is moved substantially perpendicularly to the shaft 3 by being kept at a definite interval from the outer face of the roller 2; a treatment is executed. Thereby, the electrodes on the surface of the semiconductor wafer 1 are dissolved only at their top parts and all are processed to a uniform height.</p> |
