| 摘要 |
PURPOSE:To improve the adhesive strength of a semiconductor wafer, by forming the difference in the thickness of the time when the load of 300gf/cm<2> is applied and that of the time when the load of 1800gf/cm<2> is applied in 1-100mum, forming a hole on the wafer holding face and making this bore diameter in 10-30mum. CONSTITUTION:A backing pad 1 used for a holding jig which holds a semiconductor wafer 8 at the specular polishing stage of the semiconductor wafer 8 is made of a hydrophobic foaming body. Moreover, the diffewrence in the thickness of this pad 1 at the time when the load of 300gf/cm<2> is applied and that of the time when the load of 1800gf/cm<2> is applied is taken in 1-100mum. A hole 2 is formed on this wafer holding face and this bore diameter is amde in 10-30mum. After the precise flattening of this backing plate 1, the ware 8 is held and polished by the wafer holding jig that the template 6 having more than one hole for wafer positioning on a carrier plate 3 is fixed so that the backing pad 1 may come into the hole for positioning. |
