| 摘要 |
<p>PURPOSE:To prevent leaving behind good chips on the semiconductor pellet and to reduce wasted work time on picking up by moving an X-Y table in a specified direction after perceiving the positional relationship between the virtual circle equation for a wafer and a semiconductor pellet located in the outer edge of a wafer. CONSTITUTION:An operation unit 27, which performs the virtual circle equation for a wafer 18 using the detection results from an optical identification unit 25, and a control mechanism 26, which moves an X-Y table in a specified direction after perceiving the positional relationship between the virtual circle equation and a semiconductor pallet 19 located in the outer edge of the wafer 18, are readied. Since the virtual circle equation can be set as the yardstick for the presence of the outer edge of the wafer 18, time wasted trying to identify the position of the semiconductor pellet 19 using the optical identification unit 25 and time wasted moving the X-Y table 11 can be kept to an absolute minimum. As a result, the need to suspend the semiconductor pellet pick-up process is reduced and operating efficiency is improved.</p> |
