| 发明名称 |
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| 摘要 |
A semiconductor device 11 having a moulded plastics body 12 has its stage 13 on which the semiconductor chip 14 is mounted formed separately from the lead frame 21 carrying the leads 15. This enables the innermost part 15a of the leads 15 to overlap the stage 13 and the chip 14. With this arrangement the width of the chip 14 may be close to that of the plastic body 12 without decreasing the resistance of the inner leads 15a to the pull out from the plastic body 12. The layout of the inner leads 15a is also not restricted since the inner leads 15a may occupy the region above the chip 14. |
| 申请公布号 |
JPH041503(B2) |
申请公布日期 |
1992.01.13 |
| 申请号 |
JP19820177353 |
申请日期 |
1982.10.08 |
| 申请人 |
FUJITSU LTD |
发明人 |
KUBOTA AKIHIRO;SUGIURA RIKIO;AOKI TSUYOSHI;ONO MICHIO |
| 分类号 |
H01L23/48;H01L21/56;H01L21/60;H01L23/31;H01L23/495;H01L23/50 |
主分类号 |
H01L23/48 |
| 代理机构 |
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