Power doubler amplifier module with improved solder coverage between a heat sink and a thermal pad of a circuit package

摘要

In one embodiment, an apparatus includes a printed circuit board, and a circuit package mounted to the printed circuit board. The circuit package has a thermal pad. A first heat sink structure of the module is associated with the printed circuit board and has a wall defining a contact surface that contacts and thermally couples with the thermal pad. The wall includes at least one aperture there-through. Solder paste is provided between the contact surface and the thermal pad to bond the contact surface to the thermal pad, with the at least one aperture being constructed and arranged to aid in outgassing of the solder paste.

主权项

1. An apparatus comprising:
a printed circuit board; a circuit package comprising a QFN (Quad Flatpack No lead) package mounted to the printed circuit board, the circuit package having a thermal pad and having a power consumption as high as about 17.7 W/cm2; a first heat sink structure associated with the printed circuit board and having a wall defining a contact surface that contacts and thermally couples with the thermal pad, the wall including at least one aperture there-through, and solder paste between the contact surface and the thermal pad to bond the contact surface to the thermal pad, with the at least one aperture being constructed and arranged to aid in outgassing of the solder paste, wherein the apparatus is a power doubler amplifier.