Wire bond through-via structure and method

摘要

A stackable integrated circuit chip layer and module device that avoids the use of electrically conductive elements on the external surfaces of a layer containing an integrated circuit die by taking advantage of conventional wire bonding equipment to provide an electrically conductive path defined by a wire bond segment that is encapsulated in a potting material so as to define an electrically conductive wire bond “through-via” accessible from at least the lower or second surface of the layer.

主权项

1. An electronic device comprising:
a layer comprising a first surface and a second surface, an integrated circuit chip having an active surface with a bond pad and an inactive surface, and, a cross-section of an encapsulated wire bond segment in electrical connection with the bond pad and exposed on the second surface of the layer.