Bonding multilayer circuit boards - applying heated dies on press after boards are accurately aligned

摘要

A multi layered circuit board is produced from individual plates bonded together in a pressing operation. The plate stack is assembled within the lower die (2) of a tool mounted on the base of a hydroulic press. A polyamide layer (7) is located at the base of the unit. The circuit board layers has resin layer as a bonding agent. The boards and outer layers are aligned on pins (8). During pressing the die halves (1, 2) are heated. Resin (4) is contained by silicon seals (3). ADVANTAGE - Uniform bonding of circuit boards. Uniform thickness of stacks.