| 发明名称 |
PROCESS FOR ATTACHING ELECTRONIC COMPONENTS |
| 摘要 |
<p>A process for double sided attachment of components (130) to a printed circuit board (100) is described wherein surface mount components (130) soldered to a first surface of the circuit board (backside) are, once the board (100) is inverted during reflow, retained in place only by force of molten solder surface tension.</p> |
| 申请公布号 |
EP0419065(A3) |
申请公布日期 |
1991.12.18 |
| 申请号 |
EP19900309466 |
申请日期 |
1990.08.30 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
BONNELL, RALPH EVERETT;CASTELLO, GEORGE CHRISTOPHER;HOEBENER, KARL GRANT |
| 分类号 |
H05K3/30;H05K3/34;H05K13/04;(IPC1-7):H05K3/34 |
主分类号 |
H05K3/30 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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