| 摘要 |
<p>PURPOSE:To obtain a lead frame, by press working, which has facing I/0 terminals and is excellent in isolation characteristics at the time of high frequency application, by rectangularly bending an input terminal, an output terminal, and further a ground terminal stretched in the same direction from a metal frame, at their base parts. CONSTITUTION:A first stretching part 41, a second stretching part 42, and a third streching part 43 are extended in the same direction from a metal frame 10 turning to a common part. A ground terminal 11 serving as a heat sink is formed on the first stretching part 41. An input terminal 12 and an output terminal 13 are extended almost rectangularly from the second stretched part 42 and the third stretched part 43 toward the earth terminal 11. A semiconductor chip 15 is fixed at the central part of the heat sink of the earth terminal 11, and electrically connected with each terminal by using bonding wires 16. After these processes are finished, sealing is performed with resin 17, and each terminal is cut off on cutting lines 61, thereby completing a package.</p> |
