| 摘要 |
PURPOSE:To improve productivity by utilizing a plating mask of optional shape with the plating region, not including a suspending pin, on the lead frame used as the end portion of an inner lead and a bed frame opposed thereto. CONSTITUTION:A plating mask is provided on a lead frame 1, a plating metal material is blown thereto and thereby a plating region 4 is formed only at both end portions of an inner lead 5 and a bed frame 2. Since a suspending pin 3 is not plated, the plated layer is never exposed at the outside of resin on the occasion of resin sealing of the lead frame and chip. According to this constitution, the efficiency of process is improved because the plated region is reduced, diffusion of plating metal can be eliminated because the suspending pin is not plated, and migration by the plating metal can also be eliminated. The plating mask can be formed easily and diffusion of plating metal to the rear side of bed frame 2 can be suppressed effectively. |
