发明名称 FLAT PLATE METALLIC ELECTRODE FOR ORNAMENTAL ELECTRODE
摘要 PURPOSE:To produce an ornamental electrode with which a sufficient electrode area is assured and which has an excellent adhesive property to a functional film and a long life by forming the functional film to the area of >=2 times the area of a metallic layer. CONSTITUTION:Sapphire is used as a substrate 3 of, for example, a metallic electrode 1 and gold is used as a metal. The gold is produced by an IC producing process (pattern formation by a resist, vacuum vapor deposition, sputtering), etc. Bovine serum albumin crosslinked with glutaraldehyde is used as the functional film 2 and is applied by spin coating. The width of the functional film 2 is specified to 100mum and the thickness to 2mum. The metallic electrode is formed to 50mum width and 1mum thickness. The sufficient part where the substrate 3 and the functional film 2 adhere is taken and the peeling of the film 2 is prevented by forming the film 2 to the area of >=2 times the area of the metallic layer in such a manner. The long-life ornamental electrode with which the sufficient electrode area is assured and which has the excellent adhesive property to the functional film is produced in this way.
申请公布号 JPH03273154(A) 申请公布日期 1991.12.04
申请号 JP19900072210 申请日期 1990.03.23
申请人 NEC CORP 发明人 MIYAMOTO SHIGEYUKI
分类号 G01N27/333;G01N27/327 主分类号 G01N27/333
代理机构 代理人
主权项
地址
您可能感兴趣的专利