| 摘要 |
PURPOSE:To reduce the waste of a film, to reduce that a lead is deformed and that an IC chip is damaged and to shorten a lead time by a method wherein an IL bonding operation and an OL bonding operation are executed as a series of processes inside the same apparatus without feeding a film carrier. CONSTITUTION:An IL bonder tool-head part 10 attached to a slide unit 8 is moved forward after an alignment operation is completed; and an IL bonding operation is executed. A film carrier 15 whose IL, bonding operation has been finished is punched to a prescribed shape by using a punching die 11 which is moved forward by the slide unit 8; it is taken out by using a knockout 4; and after that, it is picked up by using a suction pad 18. During the IL bonding operation, the suction pad 18 is lowered down to an alignment position by using a cylinder; in addition, an alignment operation in the theta direction is executed by using a motor 35; and after the alignment operation has been completed, the OL bonding operation is executed. Thereby, the waste of a film is reduced; it is reduced that a lead is deformed and that an IC is damaged; and a lead time can be shortened. |
