| 摘要 |
PURPOSE:To avoid a wiring from coming into contact with a chip mounting region even if a stress is applied from the upper direction by a method wherein an insulating film is provided on a region between a lead frame with a semiconductor chip mounted thereon and metal leads and the wiring, such as a copper wire, a gold wire or the like, is formed on this film while being given a proper looseness. CONSTITUTION:When an extraction electrode 12a on a semiconductor chip 12 mounted on a conductive substrate 11 is connected with a wiring electrode 11a isolated from the substrate 11 by a conductor 13, an insulative and filmlike substrate 14 is provided on a region between the electrode 11a and the substrate 11 and the conductor 13 is wired with a proper looseness so that it is positioned on this substrate 14. For that purpose, an opening is formed in the substrate 11, the substrate 11 is divided into an electrode formation region Al for forming an electrode 11a, and a chip mountable region A2 for mounting the chip 12, and the insulative substrate 14 is made to position on a region between the region A1 and the region A2. According to the method, at the time of treatment of a package subsequent to a wire bonding process, the substrate 14 works as a stopper and there is no possibility that the conductor 13 comes into contact electrically with the substrate 11. |
