| 摘要 |
<p>PURPOSE:To reduce the thickness of an IC module by bonding an IC chip to the upper surface of a metal plate and bonding lead wires to the electrode thereof and the upper surface of the metal plate and sealing both of them by a resin before applying mask etching to the metal plate to form an electrode plate. CONSTITUTION:IC chips 11 are successively bonded to the upper surface of a long metal plate 31 at a required interval and the lead wires 15 bonded to the electrodes thereof are led out and the end parts 16 thereof are bonded to the appropriate positions of the upper surface of the long metal plate 31 around the IC chips 16. Next, he IC chips 11 and lead wires 15 fixed to the upper surface of the long metal plate 31 are positioned within a mold 41 and molded by a transfer mold to form a sealed resin body 13. Thereafter, masking 45 is applied to the under surface of the long metal plate 31 and dry etching treatment is applied thereto to leave only the metal plate 31 at the part where the mask 45 is formed. By this method, an IC module for an IC card having the metal plate 31 thus left provided to the under surface thereof as an electrode plate 18 is obtained.</p> |
