| 摘要 |
<p>An integrated circuit package and method of making the package which allows an integrated circuit die to be bonded to a substrate without need of a carrier. The integrated circuit die has opposed active and passive surfaces and has lateral surfaces. An electrically insulative layer of material is deposited on the passive and lateral surfaces. A metal mask is formed to cover the active surface and the coated lateral surfaces. The metal mask includes slots which extend up the lateral surfaces and onto the active surface. The array of slots corresponds to an array of input/output contact pads on the active side. Metal is sputtered into the slots, whereafter the mask is removed to provide L-shaped conductive traces from the contact pads along the active and lateral sides. The assembly can then be rested on a substrate on the passive surface and the L-shaped traces bonded to contact pads on the substrate. The assembly allows testing at the die level.</p> |
