| 摘要 |
<p>PURPOSE:To perform stabilized peeling, by a method wherein a detecting part detecting a plate thickness of a base and a base correcting mechanism interlocking with the detecting part are provided in a film peeling device to be used for manufacture of a printed wiring board. CONSTITUTION:A base 1 carried in by a conveyor belt 10 is detected by a base detector 11, a position is adjusted by a base adjusting mechanism 12, a plate thickness is detected by a plate thickness detector 2 and confirmed. Then the base is carried to a peeling part 13, a base end is detected by a base end detector 7, pressing force is adjusted steplessly, bend of the base is corrected and stopped at the base end. Furthermore, a film end position is detected by a film end detector 8, a film end is floated at a film end peeling part 6, air is blown against the base by an air nozzle 9, a base correcting part 5 is raised, the air is blown against the whole surface of the film end and the film is peeled off up to a peeling belt 3. Then a peeling belt 4 is moved, the base 1 is put between the peeling belts 3, 4 an the film is peeled off while carrying the base 1.</p> |
