| 摘要 |
<p>PURPOSE:To make it possible to reduce the thickness of a device by resin- sealing chips bonded on the tape with screen printing while reducing the thickness of the screen printing pattern and the thickness of resin. CONSTITUTION:A screen printing pattern 12 is placed so that a window may be positioned on a chip 8 on tape 4 and an inner lead 11 and then resin 13 and squeegee 14 are provided thereon. Then, the squeegee 14 is transferred in the direction marked with the arrow A and the resin 13 is extended through the window 11 and leveled. When the remaining resin 13' is removed with the screen printing pattern, sealing by a resin layer of the chips 8 is completed. It is, therefore, possible to control the thickness of the resin layer 15 by controlling the thickness of the screen printing pattern 12 and a gap.</p> |
