| 摘要 |
PURPOSE:To directly connect a chip to a metallic sheet hardly soldered by a method wherein a metallic film is arranged to be integrated with a metallic sheet hardly soldered through the intermediary of a resin layer and then after taking the spot-facing step for the specified position of the metallic foil and the resin layer, a metallic plated layer is arranged on the surface of the exposed metallic sheet. CONSTITUTION:A metallic foil 3 is arranged to be integrated with a metallic sheet 1 of Al, Ni, or the like through the intermediary of a resin layer 2 such as of phenolic resin, melamine resin. Next, as for a laminated sheet 4, the spot-facing step is taken for the metallic foil 3 and the resin layer 2 on the specified position to mount a chip for exposing the specific part of the metallic sheet 1 as a base metal. The exposed part 5 of the metallic sheet 1 is metallic- plated such as copper plating, solder plating etc. Such a laminated sheet 4 thus plated is patterned by conventional etching process to fix parts 7 in specified positions for mounting a bare chip 8 on the plated layer 6 in the exposed part 5. Successively, the specified positions are connected by bonding wires 9.
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