| 摘要 |
PURPOSE:To make improvement in yield and the reliability of products by providing side line electrodes and bypassing the electrodes, thereby maintaining the conduction between the electrodes and leading-out terminals even when a discontinuity arises in the electrodes. CONSTITUTION:A coating layer 2 deposited on a substrate 1 is provided with internal via holes 2a and external via holes 2b of, for example, 0.25 mmphi by etching so as to expose respectively the internal junctures 4a positioned on the inner side of seals 5 and external junctures 4b positioned on the outer side of the seals 5 at the ends of the side line electrodes 4. The internal and external junctures 4a, 4b of the side line electrodes 4 are conducted respectively through the internal and external via holes 2a, 2b when an ITO film is deposited over the entire surface of the coating layer 2 and is etched to stripe shapes to constitute the electrodes 3. The conduction is maintained through the internal via hole 2a the internal juncture 4a the side line electrode 4 the external juncture 4b the external via hole 2b the leading-out terminal 3a in this way even if the electrodes 3 are disconnected by the external force of the seal 5 as the seal 5 crosses the central part of the side line electrodes 4. |
