| 摘要 |
A semiconductor device (10) having a package sealed by a UV-curable, thixotropic, acrylated epoxy (26) and a method for sealing the package are disclosed. The package is sealed at room temperature by polymer cross-linking of the epoxy (26) which is initiated by exposure of at least a portion of the epoxy to ultraviolet (UV) frequency radiation. In accordance with one embodiment of the invention, a base (12) is provided having an electronic component (14) attached to the base (12) at a predetermined location. A lid (24) having a layer of UV-curable epoxy (26) screen-printed to a bonding portion (34) is positioned onto the base (12) enclosing the electronic component (14) within a cavity (30) formed by the union of the base (12) and the lid (24). The lid (24) is sealed to the base (12) at room temperature by irradiating an exposed edge portion of the epoxy layer with UV frequency radiation. The formation of the seal at room temperature avoids thermal damage to temperature sensitive materials in both the package and the enclosed electronic component (14). <IMAGE> |
