| 摘要 |
A body having a surface for facilitating liquid adherence includes a substrate and a layer of etchable material on a surface of the substrate. Grooves having re-entrant surfaces are formed in the layer of material. In one embodiment, a heat sink for a semiconductor integrated circuit includes a heat-conducting body having a major surface and a grooved layer of a polymer on the major surface. The layer of polymer is encased in a metal layer which provides strength and electrical and thermal conductance. Reactive ion etching can be employed to form the grooves in the polymer, and metal sputtering and electroless plating can be employed to form a composite metal layer.
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