| 摘要 |
The essence of the invention is that, if electronic components without housings are used in the module, said components are grouped beforehand on the basis of the principle of the minimum number of terminal contacts (5) in the case of a carrier (1). If the components are accommodated in the carriers (1) arranged parallel with one another in the module, they are aligned with respect to one another and provisionally fixed. The carriers (1) are then produced, the components being finally fixed. In addition to contact areas (14), an insulating layer (6) is deposited on the current-carrying zones of the components. Organic contaminants and oxide layers are removed from the contact areas (14) of the components and the terminal contacts (5) of the carriers (1). Conductors (7) which connect the carriers (1) in the module and the components with one another and/or with the terminal contacts (5) are deposited on the surfaces of the components and carriers (1). The module is provided with heat dissipation means, each of which takes the form of heat-conducting ribs (22) in the heating zones and of a heat dissipation element (23), and with means for wiring the carriers (1) via the side faces of the module. Each carrier (1) has at least one terminal emerging at the surface of the module and serving as its external terminal. The terminal contacts (5) of the carriers (1) are connected electrically via the surface of the module and the module is enclosed in a casing (21) which provides an airtight seal. |
