发明名称 SEMICONDUCTOR DEVICE
摘要 PURPOSE:To be electrically connected surely by a method wherein an electrical characteristic is enhanced by forming an intermediate connection body such as an FPC as a multilayer structure and the intermediate connection body is connected by a wire bonding operation. CONSTITUTION:An FPC 30 is formed by forming conductor layers on the surface and the rear surface of an electrically insulating base film 32 such as a polyimide; the conductor layer on the upper layer is formed as interconnection patterns 34 which match the arrangement of inner leads of a lead frame connected to the FPC 30. On the other hand, the conductor layer on the rear surface is formed as a common conductor layer 30 which is used in common as a power- supply line or a ground line. Thereby, an electrical characteristic can be enhanced. When the FPC 30 is used, an intermediate connection body can be formed as a multilayer structure and can be electrically connected surely to the common conductor layer 36 by a wire bonding operation.
申请公布号 JPH03206630(A) 申请公布日期 1991.09.10
申请号 JP19900002382 申请日期 1990.01.08
申请人 SHINKO ELECTRIC IND CO LTD 发明人 FUKASE KATSUYA;TANAKA MASATO
分类号 H01L21/60;H01L23/28 主分类号 H01L21/60
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