| 摘要 |
PURPOSE:To improve the reliability of a resin-encapusulated type semiconductor device in LOC structure by adopting a configuration of said device which allows an insulation film to respond with the pattern arrangement of a plurality of inner leads. CONSTITUTION:An insulation film 2A on the right side is projected in shape while an insulation film 2B is rectangular in shape. The insulation films 2A and 2B are variable in shape, depending on the shape of a pattern of an inner lead 1A, which allows the whole area of the insulation films 2A and 2B to be held by the inner lead 1A. Therefore, this construction makes it possible to reduce the vaporization and expansion of water absorbed in the insulation films 2A and 2B within a package during reflow, thereby preventing the generation of cracks in the package. It is, therefore, possible to improve the reliability of a resin-encapusulated semiconductor device in LOC structure.
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