| 摘要 |
<p>PURPOSE:To form a film having excellent heat resistance and high permittivity by providing a dielectric film formed by kneading fine powder material having high permittivity and organic polymer insulating material having heat resistance in a sheet state, and electrodes formed at least on one side surface of the ferroelectric film. CONSTITUTION:Through holes 2 are formed previously through a board 1. Both side surfaces of the board 1 are printed with conductive paste, and dried to be formed with an upper electrode 4 of a capacitor and a wiring layer 5. Similarly, a unit wiring sheet 8 printed with a lower electrode 7 of the capacitor is formed on a thermoplastic material 6, fine powder material having high permittivity and organic polymer insulating material having heat resistance are kneaded, and disposed on an inner layer in the form of a dielectric film 9. Then, a plurality of the sheets 8 and the films 9 are laminated, and thermally press-bonded thus producing a multilayer wiring circuit module containing a capacitor formed of the electrodes 4, 7 and the film 10.</p> |
