| 摘要 |
PURPOSE:To obtain a low cost and high reliability thick film multilayer interconnection device by a method wherein, after a lower layer wiring part is formed on an insulating board, a green sheet is applied and pressed and glass paste is applied to the surface and the whole laminated unit is baked. CONSTITUTION:A lower layer conductor 12 is formed on a board 11 and a green sheet 13 having a through-hole for connecting an upper layer conductor 15 to the lower layer conductor 12 is pressed against the board 11 and the lower layer conductor 12. Further, an overcoat glass layer 14 is printed on the surface and the whole laminated unit is dried and baked. After one baking process, the upper layer conductor 15 is formed. A long as a green sheet is employed, crackings 17 are produced in step parts. However, the glass component of the overcoat glass layer 14 penetrates into the crackings 17 and an electric short-circuit between the lower layer conductor 12 and the upper layer conductor 15 can be avoided by the overcoat glass layer 14 itself. With this constitution, only one baking process is sufficient and a low cost thick film multilayer interconnection device can be obtained and, further, a dielectric breakdown caused by microcrackings can be also avoided. |
