| 摘要 |
PURPOSE:To perform easy and positive soldering with thick solder deposited by forming several continuous protruded portions in a semicircular shape in cross section on the surface of a portion used in insertion into a mother board, etc. CONSTITUTION:On the surface of a terminal pin 1 which is to be a portion used in insertion into a mother board, annular protruded portions 2 in a semicircular shape in cross section are arranged at equal spaces. Soldiering to the terminal pin 1 is made in such a manner that the terminal pin 1 is inserted into a through-hole which is formed in a pin grid array PGA and a portion, which is protruded from a PGA plate and which has the surface provided with the protruded portion 2 in a semicircular shape in cross section, is immersed in a solder reservoir which is heated and melted to fix the terminal pin 1 which is inserted into the through-hole in the PGA plate to the PGA plate and at the same time to pick up the immersed portion out of the solder reservoir. At this time, a cavity between the protruded portions 2, 2 on the surface provides anchor effect to allow thick solder 5 and easy and positive soldering. |
