Semiconductor device comprising a support and method of manufacturing such a semiconductor device.

摘要

A semiconductor device comprising a support (1) provided with a groove (2) having walls (3 and 4), on which conductors (6 and 7) are present, which conductors extend to on the support (1), and with a semiconductor element (11) which is present in the groove and makes electrical contact with the conductors on the walls. According to the invention, the semiconductor element (11) is clamped in the groove (2), thus making electrical contact with conductors (6 and 7) on walls (3 and 4). Since the semiconductor element (11) is held clamped-in between the conductors (6 and 7) on the walls (3 and 4), it is achieved that both a mechanical and an electrical connection is realised between semiconductor element (11) and support (1) in a single process step and in a simple manner.