| 摘要 |
PURPOSE:To accurately inspect whether chip parts are mounted on prescribed positions by image-picking up the package chip parts by means of a color television camera and analyzing the area of an electrode part occupied in a widow internal part. CONSTITUTION:The mounting state of the chip parts is judged by comparing distribution data of R, G and B, which correspond to the colors of the electrode part peculiar to the chip parts being an inspected object with distribution data of three primary colors R, G and B of a CAD data memory 4 being a reference. Thus, a trouble that a judgement result becomes unstable by the reflection and shadow of light owing to illumination and the peripheral electronic parts, which cannot be avoided by judgement only by density information is eliminated. A window picture extraction part 5 generates a window in a position at the inner side of an electrode part area and picture data only in the window area is used. Thus, erroneous recognition which occurs owing to the similarity of the color of a soldering surface in the outline part of the chip parts and the electrode part can be reduced. |
