发明名称 Electronic component mounting apparatus
摘要 By providing an electronic component mounting apparatus which an adjusting mechanism for adjusting the amount of drive in a path of transmission of drive from a drive unit, which is used for driving each component mounting head between elevated and lowered positions, to each component mounting head, the limit of position to which each component mounting head can be lowered is made adjustable. The provision of a control unit is also made to control the lowered position of each component mounting head according to the height of each of the electronic components to be mounted by the apparatus. The control unit is also operable to determine the lowered position of each component mounting head for the mounting of subsequent electronic components with the height of a first mounted one of the electronic components taken as a reference value so that a correction value can be added to the reference value when the succeeding electronic components are to be mounted.
申请公布号 US5033185(A) 申请公布日期 1991.07.23
申请号 US19890336903 申请日期 1989.04.12
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 HIDESE, WATARU
分类号 B23P21/00;H05K13/00;H05K13/04 主分类号 B23P21/00
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