| 摘要 |
<p>PURPOSE:To enable a semiconductor integrated circuit device to hardly malfunction due to unwanted signals induced from a power supply line and to make it small in mounting area by a method wherein one or more sets of a semiconductor integrated circuit chip and a power supply bypass capacitor connected to it are built in a resin-sealed semiconductor integrated circuit. CONSTITUTION:Adhesive agent is applied onto a metal lead frame 1, and a dielectric 2 is bonded to it. Moreover, an electrode 3 is bonded thereon. The lead frame 1, the dielectric 2, and the electrode 3 constitute a capacitor. Then, an insulating film 4 is made to adhere to the electrode 3. At this point, a hole is previously bored in the insulating film 4 or the insulating film 4 smaller than the electrode 3 in area is used for wire-bonding. A semiconductor integrated circuit chip 5 is bonded onto the insulating film 4, the power supply terminal of the chip 5 is connected to a power supply 3 and the lead frame 1 by a gold bonding wire 7. By this process, a power supply bypass capacitor is connected to the power supply terminal of the semiconductor integrated circuit chip 5. The same as above, the terminal of the chip 5 is connected to a lead 6 with a bonding wire 8. Lastly, a semiconductor integrated circuit device formed as above is sealed up with a resin mold 9.</p> |
