发明名称 |
Surface mounted single in-line electronic component package with mounting projections and chamfered viewing edge |
摘要 |
A single in-line package adapted for surface mounting to a printed circuit board comprises an electronic component, a plurality of leads and a specially configured housing that encloses and protects the electronic component. The outer ends of the leads extend adjacent a tapered lower edge of the housing. The housing further has projections for engaging the upper surface of a printed circuit board to maintain the housing in a stable upright orientation with the outer ends of the leads in physical contact with corresponding solder pads on the printed circuit board during solder re-flow. The tapered edge of the housing is configured to permit subsequent inspection of a plurality of resulting solder joints for acceptable whetting.
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申请公布号 |
US5032953(A) |
申请公布日期 |
1991.07.16 |
申请号 |
US19900567601 |
申请日期 |
1990.08.15 |
申请人 |
PULSE ENGINEERING, INC. |
发明人 |
CARL, ROBERT L.;WAI, KA K.;ORTEGA, JOSE L. V. |
分类号 |
H05K3/30;H05K5/00 |
主分类号 |
H05K3/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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