| 摘要 |
PURPOSE:To curtail expenditure for a reticle and cope with problems which are accompanied with appearance of new size of semiconductor chips by allowing the reticle concerned to be used in common for wafers having the semiconductor chips which are different in size. CONSTITUTION:All of scribe lines 3 are not exposed collectively by a reticle 1 and then, peripheral parts of each semiconductor chip are not exposed simultaneously and, in the same way as one side of longitudinal sides which are facing each other in each semiconductor chip, one side of transverse sides is exposed. As the whole area of the scribe lines 3 are exposed by repeating its exposure through step-movement, the reticle is used in common for wafers having the semiconductor chips which are different in size. In such a case, partial overlapping of exposure takes place and there is the possibility that the accuracy of resist patterns which are formed in a post process is worsened. However, in view of the accuracy required for the scribe lines 3, the deterioration of its accuracy can be neglected. In a process exposing only the scribe lines 3, expenditure for the reticle to be used for exposure is curtailed and further, the above-mentioned common use of the reticle may respond to problems which are accompanied with appearance of new size of the semiconductor chips. |
