| 摘要 |
PURPOSE:To perform high desification of mounting an LSI by forming an insulating layer covering a part of a substrate wiring on a substrate and mounting the LSI on this insulating layer. CONSTITUTION:A substrate 1 has a wiring 2 having a prescribed pattern, a part of the wiring of the substrate 1 is covered with an insulating layer 3 consisting of glass or polyimide and the LSI is mounted on the insulating layer 3 through the insulating die bonding paste 5. That is, the LSI is placed on the substrate 1 through the insulating layer 3 and die bonding paste 5. In this way, the LSI 4 is mounted on the wiring 2 of the substrate 1 through the insulating layer 3 so that the LSI can be mounted with high density.
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