| 摘要 |
PURPOSE:To enable a heat sink to be connected to a lead frame easily regardless of increased number of pins of the lead frame by placing the heat sink onto the central part of the lead frame and by performing caulking connection at a part with a sufficient caulking area. CONSTITUTION:A lead frame 11 with a number of leads 15 and a heat sink frame 21 with a heat sink 24 are formed separately. The heat sink 24 is placed at a specified position within a space 16 at the central part of the lead frame 11, the lead frame 11 and the heat sink 21 are superposed, a hole 17 and a boss part 25 which are located at interlocking parts 12 and 22 are engaged, and the boss part 25 is compressed, thus enabling both to be caulked. After that, wire bonding is performed by mounting a circuit chip C, a suspension pin 23 in cut off along with the lead 15, and the heat sink 24 is cut off from the heat sink frame 21. |
