| 摘要 |
PURPOSE: To prevent electronic parts from receiving structural damages under a wide range of vibrating conditions by providing an adhesive layer, which forms an integrated complex material by sticking a thin board to a graphite layer between each thin board and the graphite layer. CONSTITUTION: A core 10 is normally provided with a graphite layer 12 held between two molybdenum layers 14. Titanium layers 16 are arranged between the layers 14 and 12 and form the core 10, by respectively sticking the molybdenum layers 14 to the graphite layer 12. The core 10 provides a surface-mounting electronic module with a high-performance heat sink material. The core 10 not only provides the module with a material having a low density, high heat conductivity, and high specific rigidity, but also gives the module the control over the coefficient of thermal expansion(CTE) which is required to obtain high reliability, by using a ceramic chip carrier in an environment such that the module is subjected to thermal stresses. |
