| 摘要 |
PURPOSE:To prevent damage to an encapsulation and improve reliability of automatic mounting by inserting a lead body into a printed-circuit board using an automatic mounting machine and by escaping contact between an arm and the insulating encapsulation at a flat surface which is subjected to chamfering machining when releasing the arm for chucking. CONSTITUTION:The title item is different from the conventional ones in that chamfering machining is performed at the edge part in one side surface for leading out lead bodies 3a, 3b, and 3c of an insulating encapsulation 5 for forming a flat surface 7. Thus, when mounting a semiconductor pellet 1 onto a printed-circuit board 6 by an automatic mounting machine, an arm which is not shown here is chucked normally, the tip of lead bodies 3a, 3b, and 3c is directed toward the printed-circuit board 6 and is inserted into a specified part of the printed-circuit board 6, and then the arm is released. At this time, the contact between the arm and an encapsulation 5 can be escaped by a flat surface 7, thus enabling the pellet 1 to be released smoothly from the arm and preventing it from contacting the arm carelessly. |
