| 摘要 |
<p>To improve the heat dissipation and to achieve a higher packing density, the electronic semiconductor components or hybrid components (1) of the multilayer printed circuit board are mounted directly on a common metallic carrier plate (2) without encapulation. The electronic components (1) are each arranged in window-like receiving openings (8) of a first conductor board (6) mounted on the carrier plate (2) and provided with conductor layers (5, 9, 10, 11) and are bonded to conductors (4). Some of the electrical connections of the circuit board are in a second conductor board (7) which covers the first conductor board (6) and is provided with a further conductor layer (12) and which closes the receiving openings (8). The individual conductor layers (5, 9 to 12) are interconnected electrically by means of plated-through connecting holes and/or blind holes (14, 14', 15). <IMAGE></p> |
