Cathode sputtering apparatus

摘要

In a high-rate sputtering apparatus including an anode and a cathode, the cathode having an upper sputtering surface upon which is a material to be sputtered onto a substrate, an improved cooling system. The cooling system includes a carrier plate in supporting contact with the cathode and having a lateral surface in which is formed a channel groove. Coolant tubes having outside walls in selective contact with the inside walls of the channel groove and with the lower, contact surface of the cathode are provided, with the coolant tubes further having cross-sectional profiles corresponding to those of the channel grooves. The coolant tubes may also include a plurality of longitudinally extending beads formed in the outside walls to facilitate expansion.