| 摘要 |
PURPOSE:To improve reliability of a multilayer printed circuit board having an interlayer adhesive, halo resistance and fine pattern circuit by arranging a resin layer on the surface of an inner layer agent, mechanically roughing the surface, then heating, pressurizing and shaping to integrate a laminate in which an outer layer agent is arranged on the outermost layer through a prepreg. CONSTITUTION:A resin layer 4 is arranged or the surface of a circuit 1 of an inner layer agent 2 having the circuits 1 on one or both side surfaces formed from prepreg and a metal foil such as a copper foil, etc., and a resin layer 3. After the layer 4 is arranged and dried, the surface is mechanically roughed by a sand paper or the like. Predetermined number of prepregs 5 and an outer layer agent 6 are arranged on the surface, heated, pressurized to be laminated and integrated. The prepregs 5 includes, for example, glass cloth epoxy resin prepreg, etc. As the agent 6, a copper foil, etc., is employed. A circuit is formed on the outermost layer metal foil of a laminated board integrated as above to manufacture a multilayer circuit board. |
