发明名称 MANUFACTURE OF LAMINATED BOARD
摘要 <p>PURPOSE:To reduce warpage by superposing a long-sized metallic foil onto one-side outer surface of a plurality of long-sized fluoroplastic-impregnated base materials, pressing and heating the base materials and the metallic foils while being made to travel, laminating and unifying them and cutting them in specified size and quenching them. CONSTITUTION:A long-sized metallic foil 20 is superposed onto at least one-side outer surface of a plurality of long-sized fluoroplastic-impregnated base materials 10, pressed by a pair of upper and lower belts 40, 41 while being made to travel, and heated and laminated and unified, and cut in specified size and quenched. The same base material as one for manufacturing a normal fluoroplastic laminated board is used as the fluoroplastic-impregnated base material 10. Various conductor metals or nonconductive metals can be employed as the metallic foil 20 in response to the usage object, etc., of the laminated board. Accordingly, the fluoroplastic laminated board having the low rate of warpage and excellent quality can be manufactured.</p>
申请公布号 JPH03130144(A) 申请公布日期 1991.06.03
申请号 JP19890270022 申请日期 1989.10.16
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 YOSHIMITSU TOKIO;IKOMA SUNAO
分类号 B32B15/082;B32B37/10;B32B43/00;H05K1/03;H05K3/02 主分类号 B32B15/082
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