| 摘要 |
PURPOSE:To make small the thermal expansion coefficient of a laminated sheet and to contrive the improvement of the through-hole reliability and the heat dissipation property of the sheet by a method wherein the laminated sheet is formed using a prepreg obtainable by a method wherein a thermosetting resin varnish containing an inorganic filler of a good heat conductivity is impregnated in a fibrous base of a small thermal expansion coefficient and is made to dry. CONSTITUTION:A prepreg is obtained by a method wherein a thermosetting resin varnish containing an inorganic filler of a good heat conductivity is impregnated in a fibrous base of a small thermal expansion coefficient and is made to dry. As the fibrous base of a small thermal expapsion coefficient, a paper or a cloth consisting of e.g. an aramide fiber, which is an organic fiber having a negative thermal expansion coefficient, is exemplified. Moreover, as the thermosetting resin, an epoxy resin, a polyimide resin and these modified resins and the like are desirably used, but any resin is specially limited. Thereby, a laminated board, which is small in thermal expansion coefficient in the directions X and Y and the direction Z and is superior in through-hole reliability, heat dissipation property and mechanical strength, is obtained. |
