| 摘要 |
PURPOSE:To obtain a printed-wiring board having an improved resolution with enhanced reproducibility without being affected by scattering of development conditions by dipping a resist film on a printed-circuit board into a weak alkali solution and performing drying process before the development process for enabling a light decomposition resin within an electrodeposition paint to increase alkali resistance property owing to the reaction at an area between light-sensitive base parts. CONSTITUTION:A positive type light-sensitive resist film is formed on a printed-circuit board having a conductive film by the electrodeposition painting method. Activation energy rays are irradiated onto the positive type light-sensitive resist film through a photo mask screening the part for forming a conductor from the activation energy rays. Then, as a discrimination treatment of an exposed and non-exposed parts on development, the resist film is dipped into a weak-alkali solution and then is dried. The resist film is developed, the exposed copper plating part is removed by etching, and the resist film on the remaining part for forming conductors is eliminated. An approximately 1-3% aqueous solution consisting of sodium carbonate, metasilicic acid soda, amine, etc., is desirable for the weak alkali aqueous solution. It is desirable that the temperature of a dipping liquid should be 20-35 deg.C and the dipping time should be 10-30 seconds. |
